Autoři:
Yun, S., Yang, X., Wang, B., Ji, C., Lin, B., Bai, X.
Zdroj:
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(6):1113-1122 Jun, 2024
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