Implementation of multi-UAV communication relay function based on mobile telecommunication technology.

Auteurs: Tsai, Wen-Chung¹ (AUTHOR) azongtsai@nutc.edu.tw, Huang, Nien-Ting² (AUTHOR) edward_huang@arcadyan.com.tw

Bron: EURASIP Journal on Wireless Communications & Networking. 3/26/2025, Vol. 2025 Issue 1, p1-36. 36p.

Onderwerpstermen: *INFORMATION & communication technologies, *INTEGRATED circuits, *DRONE aircraft, *SYSTEMS on a chip, *TELECOMMUNICATION

A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS.

Auteurs: Peng XU¹, Huan HUANG¹, Fa ZOU², Chun SHAN^1,3 shanchungpnu@126.com

Bron: Thermal Science. 2025, Vol. 29 Issue 2A, p873-887. 15p.

Onderwerpstermen: *THREE-dimensional integrated circuits, *HEAT transfer, *FILLER materials, *STEADY-state responses, *COPPER

Simultaneously enhance electric and magnetic Purcell factor by strong coupling between toroidal dipole quasi-BIC and electric dipole.

Auteurs: Tan, Zi-Qiang^1,2 (AUTHOR), Lin, Qi^1,3 (AUTHOR), Du, Wen-Juan¹ (AUTHOR), Wang, Ling-Ling³ (AUTHOR), Liu, Gui-Dong^1,3 (AUTHOR) gdliu@xtu.edu.cn

Bron: Journal of Applied Physics. 1/21/2025, Vol. 137 Issue 3, p1-8. 8p.

Onderwerpstermen: *QUALITY factor, *INTEGRATED circuits, *PHOTONS, *DIELECTRICS, *METALS

Novel, compact electrochemical and impedance instrumentation.

Auteurs: Tran Nhu, Chi¹ (AUTHOR), Vu Quoc, Tuan¹ (AUTHOR) vqtuan0211@vnu.edu.vn, Do Quang, Loc² (AUTHOR) locdq@hus.edu.vn, Nguyen Dang, Phu¹ (AUTHOR), Nguyen Hong, Son¹ (AUTHOR), Chu Duc, Trinh¹ (AUTHOR), Bui Thanh, Tung¹ (AUTHOR)

Bron: Instrumentation Science & Technology. 2025, Vol. 53 Issue 1, p28-43. 16p.

Onderwerpstermen: *ANALOG integrated circuits, *RC circuits, *HIGH performance computing, *IMPEDANCE spectroscopy, *ELECTRIC impedance

THE ADOPTION OF NOVEL COOLING LIQUIDS FOR ENHANCING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS WITH EMBEDDED MICRO-CHANNEL.

Auteurs: Huan HUANG¹, Chun SHAN¹, Futang LONG¹, Zongjie ZENG¹, Lei XIE², Fa ZOU³, Peng XU¹ xupeng@gpnu.edu.cn

Bron: Thermal Science. 2025, Vol. 29 Issue 1A, p227-250. 24p.

Onderwerpstermen: *THREE-dimensional integrated circuits, *NANOFLUIDS, *HEAT transfer fluids, *HEAT transfer, *MICROCHANNEL flow, *LIQUID metals, *MICROFLUIDIC devices, *LIQUIDS

Gordon Mah Ung, PCWorld editor and renowned hardware journalist, dies at 58.

Auteurs: PHILLIPS, JON (AUTHOR)

Bron: PCWorld. Feb2025, Vol. 43 Issue 2, p7-10. 4p. 4 Color Photographs.

Onderwerpstermen: *EXECUTIVE departments, *INTEGRATED circuits, *TECHNICAL manuals, *PODCASTING, *LAW enforcement

Selecting alternative metals for advanced interconnects.

Auteurs: Soulié, Jean-Philippe¹ (AUTHOR), Sankaran, Kiroubanand¹ (AUTHOR), Van Troeye, Benoit¹ (AUTHOR), Leśniewska, Alicja¹ (AUTHOR), Varela Pedreira, Olalla¹ (AUTHOR), Oprins, Herman¹ (AUTHOR), Delie, Gilles¹ (AUTHOR), Fleischmann, Claudia^1,2 (AUTHOR), Boakes, Lizzie¹ (AUTHOR), Rolin, Cédric¹ (AUTHOR), Ragnarsson, Lars-Åke¹ (AUTHOR), Croes, Kristof¹ (AUTHOR), Park, Seongho¹ (AUTHOR), Swerts, Johan¹ (AUTHOR), Pourtois, Geoffrey¹ (AUTHOR), Tőkei, Zsolt¹ (AUTHOR), Adelmann, Christoph¹ (AUTHOR) Christoph.Adelmann@imec.be

Bron: Journal of Applied Physics. 11/7/2024, Vol. 136 Issue 17, p1-34. 34p.

Onderwerpstermen: *COPPER, *LINE drivers (Integrated circuits), *TRANSISTORS, *METALS, *PREPAREDNESS

Progress and comparison in nondestructive detection, imaging and recognition technology for defects of wafers, chips and solder joints.

Auteurs: Fang, Tianyu¹ (AUTHOR), An, Junshu² (AUTHOR), Chen, Qi¹ (AUTHOR), He, Yunze¹ (AUTHOR) hejicker@163.com, Wang, Hongjin¹ (AUTHOR), Zhang, Xiaogang¹ (AUTHOR)

Bron: Nondestructive Testing & Evaluation. Oct2024, Vol. 39 Issue 6, p1599-1654. 56p.

Onderwerpstermen: *MANUFACTURING defects, *INTEGRATED circuits, *INDUSTRIAL electronics, *MANUFACTURING processes, *ELECTRONICS manufacturing, *FLIP chip technology, *EDDY current testing

Introduction to microelectronic design in a distance learning program.

Auteurs: Kuzmicz, Wieslaw¹ (AUTHOR) wieslaw.kuzmicz@pw.edu.pl

Bron: International Journal of Electrical Engineering Education. Oct2024, Vol. 61 Issue 4, p452-462. 11p.

Onderwerpstermen: *INTEGRATED circuit design, *INTEGRATED circuits, *DIGITAL electronics, *ANALOG circuits, *DISTANCE education students

AN EQUIVALENT THERMAL CONDUCTIVITY MODEL OF THROUGH SILICON VIA ARRAYS FOR THERMAL ANALYSIS IN 3-D INTEGRATED CIRCUITS.

Auteurs: Zhao-Pei XU¹, Kang-Jia WANG¹ konka05@163.com

Bron: Thermal Science. 2024, Vol. 28 Issue 5B, p4081-4088. 8p.

Onderwerpstermen: *THREE-dimensional integrated circuits, *THERMAL conductivity, *INTEGRATED circuit design, *THERMAL analysis, *MOORE'S law, *FINITE element method, *THERMAL management (Electronic packaging), *INTEGRATED circuits

Silicon based Dielectric for Integrated Circuits – An Experimental Study.

Auteurs: Sharma, N.¹ (AUTHOR) nagksharma@rediffmail.com, Hooda, M.¹ (AUTHOR) manish.hooda@gmail.com, Sharma, S. K.² (AUTHOR) sksharma@iitism.ac.in

Bron: IETE Journal of Research. Jul2024, Vol. 70 Issue 7, p6437-6443. 7p.

Onderwerpstermen: *RADIO frequency integrated circuits, *SILICON nitride, *ANALOG circuits, *INTEGRATED circuits, *PERMITTIVITY, *SILICON nitride films

A Diffusion-Model-Based Methodology for Virtual Silicon Data Generation.

Auteurs: Chen, Liang-Yu¹ (AUTHOR), Kao, Michael² (AUTHOR), Chen, Shih-Hao² (AUTHOR) hock.chen@digwise-tech.com, Yang, Chia-Hsiang³ (AUTHOR) chyee@ntu.edu.tw

Bron: IEEE Transactions on Semiconductor Manufacturing. May2025, Vol. 38 Issue 2, p146-153. 8p.

Onderwerpstermen: *INTEGRATED circuits, MACHINE learning, DIFFUSION kinetics

Fully Automated Wafer-Level Edge Coupling Measurement System for Silicon Photonics Integrated Circuits.

Auteurs: Yuan, Quan¹ (AUTHOR) yuanq86@gmail.com, Peczek, Anna² (AUTHOR), Frankel, Joe¹ (AUTHOR), Rishavy, Dan¹ (AUTHOR), Mai, Christian² (AUTHOR), Christenson, Eric¹ (AUTHOR), Pratap, Divya¹ (AUTHOR), Zimmermann, Lars³ (AUTHOR)

Bron: IEEE Transactions on Semiconductor Manufacturing. May2025, Vol. 38 Issue 2, p168-177. 10p.

Onderwerpstermen: *INTEGRATED circuits, SILICON wafers, AUTOMATIC test equipment, INTEGRATED optics, WAVEGUIDES, OPTICAL sensors, ADAPTIVE optics, OPTICAL measurements

Compact Microwave Plasma Electrodeless UV Lamps With Low Breakdown Power and High Energy Efficiency

Auteurs: Zhu, H., Huang, Y., Zhang, G., Hu, F., Wang, Q., Yang, Y., Zhang, W.

Bron: IEEE Transactions on Plasma Science IEEE Trans. Plasma Sci. Plasma Science, IEEE Transactions on. 53(5):914-921 May, 2025

Investigation of a Transparent and Wide-Angle Reception Metasurface for Microwave Power Transfer

Auteurs: Zhang, H., An, M., Xiao, H., He, J.

Bron: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 46(5):821-824 May, 2025

Integrated Photonics and Electronics for Optical Transceivers Supporting AI/ML Applications

Auteurs: Ossieur, P., Moeneclaey, B., Coudyzer, G., Lambrecht, J., Craninckx, J., Martens, E., Van Driessche, J., Bruynsteen, C., De Busscher, J., Declercq, J., Gu, Y., Niu, S., Pannier, T., Singh, N., Van Severen, L., Bogaert, L., Maes, D., Vanackere, T., Vissers, E., Zhang, J., Kumari, S., Oldenbeuving, R., Zhang, X., Van Elzakker, G., Van Campenhout, J., Absil, P., Kuyken, B., Yin, X., Torfs, G., Missinne, J., Van Steenberge, G., Roelkens, G., Bauwelinck, J.

Bron: IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 31(3: AI/ML Integrated Opto-electronics):1-16 Jun, 2025

Power Segmentation Optimum: A Novel Technique for Continuous Optimal Efficiency Tracking in Monolithic DC–DC Converters

Auteurs: Iob, F., Scaduto, S., Alessandro, A.A., Santagati, C.A., Saggini, S.

Bron: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 40(5):6629-6642 May, 2025

Reproducibility of Microwave Breast Imaging: Analysis of Regular Scans of a Group of Volunteers

Auteurs: Wang, Z., Mojabi, P., Price, S., Lasemiimeni, Z., Besler, B., Bourqui, J., Deutscher, D., Shen, H., Docktor, B., Tsang, R.Y., Fear, E.

Bron: IEEE Transactions on Biomedical Engineering IEEE Trans. Biomed. Eng. Biomedical Engineering, IEEE Transactions on. 72(5):1562-1571 May, 2025

Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits

Auteurs: Vanna-Iampikul, P., Woo, S., Erdogan, S., Zhu, L., Kathaperumal, M., Agarwal, R., Gupta, R., Rinebold, K., Swaminathan, M., Kyu Lim, S.

Bron: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 44(5):1954-1967 May, 2025

Self-Excited Microwave Pulse Generation Based on Self-Mode-Locking Optoelectronic Oscillator

Auteurs: Chen, H., Shen, Q., Xie, T., Lin, J., Wang, Y., Fu, H., Chen, D.

Bron: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 43(8):3637-3642 Apr, 2025